![molding compound](https://host.easylife.tw/pics/201709/Amplframe.png)
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
高純度二氧化矽封裝填充材料技術與發展
- leadframe package
- lead frame
- lead frame led
- lead frame substrate
- leadframe封裝
- lead frame缺貨
- lead frame導線架
- lead frame中文
- leadframe process
- lead frame material
- leadframe材質
- lead frame導線架
- lead frame製程
- lead frame鍍銀
- lead frame中文
- flip chip on lead frame
- die attach
- led leadframe
- lead frame substrate
- lead frame material
- 導線架封裝
- lead frame封裝
- leadframe package
- leadframe manufacturing
- leadframe製程
2021年1月20日—在半導體封裝製程中,不論是傳統的導線架(LeadFrame)構裝,或是先進的覆晶(FlipChip)與晶圓級(WaferLevel)封裝,均需使用模封材料(MoldingCompound)。
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